![]() ![]() The combination of soldering flux residuals and encapsulated water could lead to short circuits between neighboring pads. Cleaning with water can lead to capillary effects where water is absorbed into the gap between the host board and the module.Residuals under the module cannot be easily removed with any cleaning process. In general, cleaning the populated modules is strongly discouraged. ITSE00099 05 BTM44x v1 3 1 240 0 UartFirmwareUpgrade.zipīTM44x v1 3 1 240 0 UartFirmwareUpgrade.zipīluetooth Development Kit Terminal Download.zipĪpplication Note - Guidelines for Replacing Antennas v1.0 PCN - BTM4x1 Label Change - 12 Aug 15.pdf Mini Dev Kit Comms - BTM41x BTM43x BTM44x v1.pdf Release Note - BTM44x Enhanced Data Module Firmware v240.pdf Application Note - Bluetooth Latency and Data.pdfĪpplication Note - BT44x Series HID Host.pdfĪpplication Note - BTM44x Enhanced Data Module-Latency Optimization.pdfĪpplication Note - BTM44x Health Device Profile.pdfĪpplication Note - BTM44x Enhanced Data Module-Throughput Analysis.pdfĪpplication Note - BTM44x-Firmware Upgrade.pdfĪpplication Note - BTM44x Getting Started.pdf
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